Our Products
Ammonical Etchant
ULTRA FINE IS AN ALKALINE ETCHING CHEMISTRY FOR THE VOLUME MANUFACTURE OF HIGH QUALITY COPPER TIN/LEAD PLATED-THROUGH-HOLE OR PRINT-AND-ETCH TYPE PRINTED CIRCUITS BOARDS. IT PROVIDES GREATER THROUGH-PUT, IMPROVED LINE WIDTH CONTROL.
View Technical DetailsAcid Cleaner
KT-180 ACID CLEANER IS A PRE-TREATMENT CLEANER SPECIALLY DESIGNED FOR THE ETCHBONDPROCESS.
View Technical DetailsSolder Mask Stripper
SOLDER MASK STRIPPER (SMS 100) SYSTEM IS DESIGNED TO STRIP SOLDER MASK INK FROM PRINTED CIRCUIT BOARDS. ITS UNIQUE BLEND OF COMPONENTS PROMOTES A HIGH STRIP RATE AND COMPLETE REMOVAL OF SOLDER MASK INK AND ADHESION PROMOTERS. IN ADDITION TO PROVIDING THE EASE OF HANDLING A PURE LIQUID CONCENTRATE.
Solder Mask Pre-Clean
KT-8800 PROCESS PRE-TREATMENT IS A UNIFORM FORMULATED ADHESION PROMOTING SYSTEM PROVIDING EXCELLENT SOLDER MASK ADHESION THROUGH ENIG IMMERSION TIN, HASL, SILVER AND OTHER ALTERNATIVE FINAL FINISHES ETC.
View Technical DetailsDeveloper
DEVELOPER DS10 IS A HIGHLY CONCENTRATED AQUEOUS PHOTORESIST DEVELOPER SOLUTION MAKING FEED-AND-BLEED CONTROL OF THE DEVELOPER SOLUTION SIMPLE AND CONSISTENT.
OUR DEVELOPER DS10 HAS ONLY SHOWN TO REDUCE SCUM FORMATION AND PREVENT SCALING ALLOWING FOR SIGNIFICANT DECREASE IN DOWNTIME AND MACHINE WEAR.
Nano Carbon
NANO-CARBON NC-1 MAKE UP IS SUSPENSION OF SPECIAL CARBON BLACK SOLUTION WHICH DESIGNED TO FORM A CARBON FILM ON DIELECTRIC SURFACE OF PRINTED CIRCUIT BOARDS. NANO-CARBON NC-1 IS USED IN REPLACEMENT OF CONVENTIONAL ELECTRO LESS COPPER THROUGH HOLE PLATING.
Anti Foam
KTFC ANTI-FOAM AF56 IS DESIGNED TO REDUCE AND HINDER THE FORMATION OF FOAM DURING THE PCB MANUFACTURING PROCESS. OUR PRODUCT HAS SHOWN TO PREVENT SEEPAGE AND GROWING DEFECTS ON SURFACE COATINGS WHILE HAVING NO CONTAMINATION OR ALTERCATION ON THE PRODUCT.
View Technical DetailsDry Film Stripper
OUR UNIQUE KTFC AMINE STRIPPER IS FORMULATED TO STRIP FULLY-AQUEOUS DRY FILM PHOTORESISTS FROM PRINTED CIRCUIT BOARDS(PCB). IT OFFERS A HIGH STRIP RATE BY MINIMIZING THE INITIAL SWELLING OF THE RESIST THAT OCCURS DURING THE STARTING PHASE OF THE STRIPPING PROCESS, THEREBY REDUCING THE MECHANICAL ENTRAPMENT OF DRY FILMS THAT NORMALLY RESULT IN POOR STRIPPING PERFORMANCE.
View Technical DetailsTin Stripper
METAL STRIPPER KTFC IS THOROUGHLY ADJUSTED STARTER SOLUTION THAT IS DESIGNED TO ELIMINATE DEPOSITS OF TIN-LEAD AND TIN ELECTRODEPOSITED ON COPPER. THE TIN-LEAD STRIPPERS CAN BE USED AS A SPRAY DURING THE PROCESS OF PCB MANUFACTURING AND IS FORMULATED TO SIGNIFICANTLY INCREASE THE SPEED OF SN STRIPPING WHILE PROTECTING THE COPPER LAYER FROM ATTACK.
View Technical DetailsSES Process Product Codes
| Process | Product Name | Product Code |
|---|---|---|
| SES Process | Dry Film stripper | RS 1000 |
| RS 2000 | ||
| RS 3000 | ||
| Ammonical Etchant | Ammonical Etchant 301 | |
| Ultra Fine | ||
| Ultra Fine Plus | ||
| Tin stripper | TS 200 | |
| TS 4600 |